How much do you know about the black technology behind chips and how to make breakthroughs?

5G, big data, artificial intelligence (AI), the Internet of Things and other applications are becoming more and more widespread. The core "brain" part of these technologies are high-computing, high-transmission, low-latency, and low-energy chips that are playing their value.

However, with the generation of massive amounts of data, computing needs have grown exponentially. How to continue Moore's Law has become a major challenge for the semiconductor industry.

Let me first introduce Oriental Linyu from two dimensions.

On the one hand, advanced process technology is required.

For most chip manufacturers, 40nm, 28nm, and 14nm technologies have become landmark milestones.

Take my country's Beidou system as an example. The main chip currently used is the 28nm process chip.

The current mainstream navigation chips are mainly based on 40nm process.

TSMC, the leader in this field, has already achieved breakthroughs in 7nm and 5nm, while leveraging its leading 3nm process to continue to achieve a 2nm lead, becoming a challenger and pioneer in continuously pushing Moore's Law to the extreme.

At present, the application of 14nm, 7nm and below chip technologies is mainly in the mobile phone field.

Therefore, there is still a long way to go to make up for the gap in advanced processes, considering the current technical reserves, manufacturing level, upstream and downstream supply chain technology of my country's chip manufacturers. Various difficulties need to be overcome one by one, in order to continuously narrow the gap with the international leading level, and even catch up with and eventually surpass the international leading level.

On the other hand, advanced packaging technology is required.

Advanced packaging is also one of the key technologies to continue Moore's Law.

For example, technologies such as 2.5D, 3D and Chiplets have become hot topics in the semiconductor industry in recent years.

When various technologies have reached a certain level and it is difficult to achieve breakthroughs in the short term, the integration of resources and technology becomes another way to improve the technology tree.

Against this background, the concept of Heterogeneous Integration Design Architecture System (HIDAS) came into being, promoting further breakthroughs in the semiconductor field and becoming an innovative driving force for Moore's Law.

The concept of heterogeneous integration is actually not difficult to understand. It is to integrate different types of chips, such as memory + logic chips, optoelectronic + electronic components, etc., through advanced technologies such as packaging and 3D stacking.

Strictly speaking, integrating chips of different processes and properties can be called heterogeneous integration.

In order to be able to deeply integrate with the latest new technologies such as communication technology, artificial intelligence, blockchain, and the Internet of Things, and at the same time emerge more new models, new business forms, and new economies of chip technology and applications, an important development trend of chips in the future is functional integration-related technologies.

In summary, as one of the most important development areas in my country at present, the chip industry must not only comply with the development laws of Moore's Law, but also focus on development and breakthroughs in areas such as advanced processes and advanced packaging.